PC and TC Diagrams

本站引用的位置4 处，涉及 4 个知识点

1. Application Note §§2–2.1 pp.3–8，wire bonds, PC stress and on-state-voltage criterion

   键合线功率循环退化

2. Application Note §§2–3 pp.3–13，die attach, solder fatigue and thermal-cycling boundaries

   芯片连接与焊层疲劳

3. Application Note §§2–4 pp.3–15，power/thermal cycling and rainflow counting

   功率循环与寿命评估

4. Application Note §2 pp.3–10，definitions, stress conditions, failure criteria and control strategy

   功率循环测试方法与应力控制