跳到正文
半导体开放世界
论文

Mechanical property changes in porous low-k dielectric thin films during processing

G. Stan; R. S. Gates; P. Kavuri; J. Torres; D. Michalak; C. Ege; J. Bielefeld; S. W. King

本站引用的位置6 处,涉及 1 个知识点

  1. Applied Physics Letters 105, 152906,第 152906-1–152906-3 页

  2. Applied Physics Letters 105, 152906,第 152906-1–152906-4 页

  3. Applied Physics Letters 105, 152906,第 152906-1、152906-3–152906-4 页

  4. Applied Physics Letters 105, 152906,第 152906-2–152906-3 页

  5. Applied Physics Letters 105, 152906,第 152906-2–152906-4 页

  6. Applied Physics Letters 105, 152906,第 152906-3–152906-4 页