Examination of Advanced Technologies in Semiconductor Device Failure Analysis

本站引用的位置2 处，涉及 4 个知识点

1. Workshop report pp.15–25，semiconductor device failure-analysis flow, emission/TDR limits and non-destructive methods

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2. Failure-analysis workflow，emission microscopy, TDR, laser and electron-beam localization sections

   IR-OBIRCH 与软缺陷定位 光发射与时间分辨失效分析