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Optimization of the Thermal Contact Resistance within Press Pack IGBTs

Erping Deng, Zhibin Zhao, Peng Zhang, Yongzhang Huang, Jinyuan Li

本站引用的位置1 处,涉及 1 个知识点

  1. Microelectronics Reliability 69 (2017), pp.17–28,Abstract, §1 Introduction and §4 Conclusions